Resin composition for mold used in forming micropattern, and method for fabricating organic mold therefrom

ABSTRACT

A resin composition for a mold used in forming micropatterns comprises (A) 40 to 90 parts by weight of an active energy curable urethane-based oligomer having a reactive group; (B) 10 to 60 parts by weight of a monomer reactive with the urethane-based oligomer, (C) 0.01 to 200 parts by weight of a silicone or fluorine containing compound, based on 100 parts of the sum of the components (A) and (B); and (D) 0.1 to 10 parts by weight of a photoinitiator, based on 100 parts of the sum of the components (A), (B) and (C). The inventive resin composition can be easily cured by the action of an active energy ray, and the organic mold fabricated therefrom is easily lifted off from a master without irreversible adhesion or generation of defects and have excellent dimensional and chemical stabilities.

FIELD OF THE INVENTION

The present invention relates to a resin composition for a mold used informing micropatterns, and to a method for fabricating an organic moldusing same and the organic mold fabricated thereby.

BACKGROUND OF THE INVENTION

Various devices including integral circuits, semiconductors, electronic,photoelectric, display, magnetic or electromechanical devices andoptical lens (e.g., prism sheet and lenticular lens sheet) involvemicropatterns which have been conventionally formed by photolithography.However, the photolithography requires a complicated patterning processand a high production cost, and is not suitable for formingultramicropatterns having a line width of below 100 nm.

Therefore, there has been recently developed a nano-imprint lithographywherein a pattern of a hard mold, e.g., a Si mold, is replicated on athermoplastic polymer layer. This method is advantageous in fabricatinga pattern having a narrow line width of about 7 nm owing to the hardnessof the mold (see S. Y. Chou et al., J. Vac. Sci. Technol. B15,2897(1997)). However, this nano-imprint lithography has the problemsthat the mold is not easily lifted off from the substrate and it maybreak during the pressurizing procedure under a high temperature andpressure condition.

Other non-traditional lithographic methods for fabricating micropatternsinclude micro-contact printing (mCP), micro-molding in capillaries(MIMIC), micro-transfer molding (mTM), soft molding, and capillary forcelithography (CFL) methods. These methods generally employ a mold made ofan elastic polymer such as polydimethylsiloxane (PDMS), which is asilicon rubber type, but the PDMS mold has poor dimensional and chemicalstabilities so that it cannot achieve a narrow pattern width of lessthan 500 nm.

Modified PDMS's including h-PDMS (hard PDMS) and hv-PDMS (photo-curablePDMS) have been developed to solve the problem of PDMS. However, h-PDMSstill suffers from brittleness, low elongation at break, and poorconformal contact with a substrate (see Odom, Y. W. et al, Langmuir, 18,5314-5320 (2002)), and hv-PDMS does not have enough modulus to replicatefine pattern below 100 nm even thouth troduced to overcome theaforementioned some limitations of conventional PDMS (see J. Am. Chem.Soc. 125, 4060-4061 (2003)).

SUMMARY OF THE INVENTION

Accordingly, it is an object of the present invention to provide a novelmold material having a modulus high enough for forming submicro-patternsand good chemical and dimensional stabilities which can be used forproducing an organic mold that can be easily and repeatedly lifted offfrom a substrate without irreversible adhesion or generation of defects.

Further, it is another object of the present invention to provide amethod for fabricating a mold using said material, and the moldfabricated thereby.

In accordance with one aspect of the present invention, there isprovided a resin composition for a mold used in forming micropatterns,which comprises:

-   -   (A) 40 to 90 parts by weight of an active energy curable        urethane-based oligomer having a reactive group selected from        the group consisting of (meth)acrylate, vinylether, arylether,        and a combination thereof;    -   (B) 10 to 60 parts by weight of a monomer (i.e., a reactive        diluent) which is reactive with the urethane-based oligomer, and        which has a reactive group selected from the group consisting of        (meth)acrylate, vinylether, arylether, and a combination        thereof;    -   (C) 0.01 to 200 parts by weight of a silicone or        fluorine-containing compound (i.e., a functionalized additive),        based on 100 parts of the sum of the components (A) and (B); and    -   (D) 0.1 to 10 parts by weight of a photo-initiator, based on 100        parts of the sum of the components (A), (B) and (C).

In accordance with another aspect of the present invention, there isprovided a method for fabricating an organic mold, which comprisescoating or casting the inventive resin composition on a pattern face ofa mastermold, placing a support on the resin layer, irradiating anactive energy ray to the resulting laminate to preliminarily cure theresin layer, lifting off the organic mold having a reverse pattern faceto that of the mastermold and integrally formed with the support fromthe mastermold, and completely curing the organic mold.

In accordance with a further aspect of the present invention, there isprovided a method for fabricating an organic mold, which comprisescoating or casting the inventive resin composition on a pattern face ofa mastermold, irradiating the resin layer with an active energy ray topreliminarily cure it, pouring a UV- or heat-curable resin compositiononto the cured resin layer as a backbone, heating or irradiating theresultant to completely cure the resin layer and the backbone layer,lifting off the organic mold having a reverse pattern face to that ofthe mastermold and integrally formed with the backbone layer from themastermold, and completely curing the organic mold.

In accordance with a still further aspect of the present invention,there is provided an organic mold having submicro-pattens, fabricated byany one of the inventive methods.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other objects and features of the present invention willbecome apparent from the following description of the invention, whentaken in conjunction with the accompanying drawings, which respectivelyshow:

FIG. 1: a schematic view showing the procedure for preparing a moldusing a resin composition according to the present invention;

FIG. 2 a: an electronic microscopic photograph of a mold having an equalline width and space of 80 nm fabricated by the inventive method;

FIG. 2 b: an electronic microscopic photograph of a pattern formed on asubstrate using the mold of FIG. 2 a;

FIG. 3 a: an electronic microscopic photograph of a mold having acylindrical pattern fabricated by the inventive method;

FIG. 3 b: an electronic microscopic photograph of a pattern formed on asubstrate using the mold of FIG. 3 a;

FIG. 4 a: an optical microscopic photograph of a mastermold having apyramid shaped pattern for use in fabricating a mold according toComparative Example;

FIG. 4 b: an optical microscopic photograph of an organic moldfabricated using the mastermold of FIG. 4 a.

DETAILED DESCRIPTION OF THE INVENTION

The present invention provides a resin composition for an organic moldto be used in forming micro-patterns, preferably submicro-patterns, anda method for fabricating the organic mold using said composition and themold fabricated thereby.

The inventive resin composition is characterized by comprising anenergy-curable components simultaneously having a hard segment such ascycloaliphatic or aromatic ring and a soft segment such as a linearaliphatic long chain, which makes it possible to form micropatterns andto impart the flexibility to a mold, and a silicon or fluorinecontaining compound which can provide a mold with an excellent releasingproperty while maintaining good physical properties of the mold. Thecompactness, i.e., the degree of cross-linkage in the molecularstructure of the mold, may be enhanced by adjusting the total amount ofthe reactive groups present in the composition.

Herein, the term “(meth)acrylate” is meant to represent acrylate andmethacrylate, and the term “active energy ray” is meant to be anultraviolet ray, infrared ray or electronic beam.

Specifically, the inventive resin composition comprises an active energyray-curable urethane-based oligomer (“Component A”) for imparting a highelasticity and bendability to the composition. The active energy curableurethane-based oligomer may be a linear aliphatic, cycloaliphatic oraromatic urethane-based oligomer having at least two reactive groups,and a mixture thereof.

The urethane-based oligomer may be used in an amount of 40 to 90 partsby weight in the inventive composition. When the amount is less than thelower limit, the mechanical strength of a mold obtained from thecomposition becomes inferior, while when the amount exceeds the upperlimit, the mold becomes too brittle.

The urethane-based oligomer may be partially substituted by a reactiveoligomer for enhancing the physical properties such as flexibility,surface hardness, abrasive resistance, thermal resistance, weatherresistance and chemical resistance of the composition. Such an optionaloligomer may be a (meth)acrylated polyester, (meth)acrylated polyether,(meth)acrylated epoxy, (meth)acrylated polycarbonate, (meth)acrylatedpolybutadiene, or a mixture thereof, and may be employed in an amount of0 to 200% by weight of the urethane-based oligomer.

In the present invention, a monomer having the reactivity with theurethane-based oligomer (“Component B”) is employed as a reactivediluent, and representative examples thereof include (meth)acrylatessuch as isobornyl acrylate, 1,6-hexanediol acrylate, triethyleneglycoldi(meth)acrylate, trimethylol propane triacrylate, tetraethyleneglycoldi(meth)acrylate, 1,3-butanediol diacrylate, 1,4-butanediol diacrylate,diethyleneglycol diacrylate, neopentylglycol diacrylate, neopentylglycoldi(meth)acrylate, polyethyleneglycol di(meth)acrylate, pentaerythritoltriacrylate, dipentaerythritol (hydroxy)pentaacrylate, alkoxylatedtetraacrylate, octadecyl acrylate, isodecyl acrylate, lauryl acrylate,stearyl acrylate, behenyl acrylate, styrenic monomer, and a mixturethereof; and vinyl ethers and aryl ethers such as cyclohexyl vinylether, 2-ethylhexyl vinyl ether, dodecyl vinyl ether, aryl propyl ether,aryl butyl ether, 1,4-butanediol divinyl ether, 1,4-hexanediol divinylether, diethylene glycol divinyl ether, ethyleneglycol butyl vinylether, ethyleneglycol divinyl ether, triethyleneglycol methylvinylether, triethyleneglycol divinyl ether, trimethylol propane trivinylether, pentaerythritol triary ether, 1,4-cyclohexane dimethanol divinylether, and a mixture thereof.

The reactive diluent can control the cross-linking density of thecomposition to impart a good flexibility to the composition, and it maybe used in an amount of 10 to 60 parts by weight in the composition.

In addition, the resin composition of the present invention comprises asilicone or fluorine group-containing compound (“Component C”) as afunctionalized additive. Component C has at least one silicon orfluorine group, and representative examples thereof include (i) areactive monomer or oligomer having a silicone group, e.g., asilicone-containing vinyl derivative, silicone-containing(meth)acrylate, (meth)acryloxy-containing organosiloxane, or siliconepolyacrylate; (ii) a reactive monomer or oligomer having a fluorinegroup, e.g., a fluoroalkyl-containing vinyl derivative,fluoroalkyl-containing (meth)acrylate, or fluorine polyacrylate; (iii) asilicone or fluorine containing resin, e.g., an organopolysiloxane, anda fluorinated polymer; and (iv) a silicone or fluorine containingsurfactant or oil, e.g., a dimethyl silicone oil; and a mixture thereof.

The functionalized additive can provide a mold with a good releasingproperty, and it may be used in an amount of 5 to 200 parts by weight,in case of the ingredients (i) to (iii), and in an amount of 0.01 to 5parts by weight, in case of the ingredient (iv), based on 100 parts ofthe total amount of Components A and B used.

The photo-initiator (“Component D”) used in the composition of thepresent invention may be a conventional free radical initiator orcationic initiator, or a mixture thereof. Representative examples of thefree radical initiator include benzyl ketals, benzoin ethers,acetophenone derivatives, ketoxime ethers, benzophenone, benzo andthioxantone compounds, and mixtures thereof, and the cationic initiatormay be onium salts, ferrocenium salts, diazonium salts, and mixturesthereof. In case a vinyl ether compound is used as Component B, it ispreferred to employ a suitable mixture of the free radical initiator andthe cationic initiator.

The photo-initiator may be preferably employed in an amount of 0.1 to 10parts by weight based on 100 parts of the total amount of Components A,B and C used.

The resin composition of the present invention can be cured with anactive energy ray to provide an organic mold having a goodreleasability, low swelling in solvent, good conformity to a substrate,and high mechanical strength. Further, the inventive resin compositioncan provide a mold having a large size in a simple process at a lowproduction cost, and therefore, it can be utilized for the massproduction of an organic mold.

The resulting organic mold can be beneficially used in forming anultramicro- or submicro-pattern having a line width of below several tennm. The formation of micropatterns using the inventive organic mold canbe conducted by any replicating method known in the art, e.g.,nano-imprint lithography, micro-contact printing (mCP), micro-molding incapillaries (MIMIC), micro-transfer molding (mTM), soft molding, andcapillary force lithography (CFL).

FIG. 1 shows a schematic view of the procedure for preparing a moldusing a resin composition according to the present invention.Specifically, as shown in the procedure (a), the inventive resincomposition is coated or cast on a pattern face of a mastermold, and asupport for the mold is covered thereon. The resulting laminate isirradiated with an active energy ray such as a UV light to preliminarilycure the resin composition. The cured organic mold having a pattern facereverse to that of the mastermold is removed from the mastermold, andfurther UV-cured until the remaining reactive group in the resin iscompletely consumed, to enhance the hardness of the organic mold. Thesupport for the mold may be preferably made of a polymer such aspolyethylene terephthalate(PET), polycarbonate(PC), polyvinylchloride(PVC), a soft or rigid elastomer, and others. The organic moldthus fabricated may be further adhered to or combined with a softelastic or hard polymer backing having a desired shape and thickness,depending on the final use of the mold. The baking may be made of anepoxy resin, urethane elastomer, butadiene-based rubber, or a mixturethereof.

Alternatively, according to the procedure (b) of FIG. 1, a mastermold isfirstly coated or cast with the resin composition of the presentinvention as in the (a) procedure and pseudo-cured with an UV light, andthereto an UV-curable or heat-curable resin composition as a backbonematerial is poured to a desired thickness in a vessel and completelycured. The cured organic mold is removed from the mastermold. The heator UV curable backbone resin may be a conventional soft or rigidpolymeric material selected from an epoxy resin, urethane elastomer,butadiene-based rubber, and a mixture thereof, depending on the finaluse of the mold.

The present invention will be described in further detail by thefollowing Examples, which are, however, not intended to limit the scopesof the present invention.

Preparations 1 to 5

Mold compositions having the composition shown in Table 1 were prepared.TABLE 1 Component Ingredient Prep. 1 Prep. 2 Prep. 3 Prep. 4 Prep. 5 (A)Active energy Difunctional aliphatic urethane acrylate oligomer*⁵ 31.037.5 31.0 31.0 36.0 curable urethane- Difunctional cycloaliphaticurethane acrylate oligomer*⁶ 25.0 — 25.0 25.0 20.0 based oligomer*¹Trifunctional aliphatic urethane acrylate oligomer*⁷ 12.5 25.0 12.5 12.527.5 Trifunctional cycloaliphatic urethane acrylate oligomer*⁸ — 12.5 —— — Hexafunctional aliphatic urethane acrylate oligomer*⁹ 6.5 — 6.5 6.511.5 (B) Reactive diluent*² 1,6-hexanediol diacrylate 12.5 12.5 12.512.5 — Neopentylglycol diacrylate 12.5 — 12.5 12.5 5.0 Trimethylolpropane (propylated) 3 triacrylate — 12.5 — — — (C) Functionalized(3-acryloylpropyl)-tris(trimethylsiloxy)silane 12.5 12.5 — — —additive*³ Silicone polyacrylate 12.5 — — — — 2,2,2-trifluoroethylmethacrylate — 12.5 — — — Dimethyl silicone oil (100 centistokes) — —1.0 — 1.0 (D) Free Radical 1-hydroxycyclohexyl phenyl ketone 2.5 2.5 2.52.5 2.5 Photoinitiator*⁴ Methyl benzoyl formate 1.5 1.5 1.5 1.5 1.5Footnote:*¹, *²part by weight*³parts by weight based on the sum of Components A and B*⁴parts by weight based on the sum of Components A, B and C*⁵a urethane reaction product of hydroxypropyl acrylate andhexamethylene diisocyanate at an equivalent ratio of 2:1*⁶a urethane reaction product of hydroxypropyl acrylate and4,4-dicyclohexylmethane diisocyanate at an equivalent ratio of 2:1*⁷a urethane reaction product of hydroxypropyl acrylate and atrifuctional triisocyanate having a structure of isocyanurate ofhexamethylene diisocyanate, at an equivalent ratio of 3:1*⁸a urethane reaction product of hydroxypropyl acrylate and atrifuctional triisocyanate having a structure of isocyanurate ofisoporone diisocyanate, at an equivalent ratio of 3:1*⁹a urethane reaction product of pentaerythritol propoxylate triacrylateand hexamethylene diisocyanate at an equivalent ratio of 2:1

EXAMPLE 1-1

An organic mold was fabricated by a replicating method as shown in theprocedure (a) of FIG. 1.

Specifically, a silicon mastermold having the reverse pattern structureof a desired resin pattern was prepared. A resin composition accordingto Preparation 1 was coated on the pattern face of the mastermold to athickness of 15 μm. Then, a transparent adhesive polyethyleneterephthalate sheet having a thickness of 188 μm was laid on the coatedsurface, and the resulting laminate was irradiated with a UV light of 5mJ/cm² for 15 seconds to cure the resin composition.

The cured organic mold was lifted off from the mastermold to obtain anorganic mold having the desired pattern combined with a polyethyleneterephthalate (PET) support. Then, UV (5 mJ/cm²) was additionallyirradiated for 2 hours to completely cure the organic mold

EXAMPLE 1-2

A replicated organic mold was fabricated as shown in the procedure (b)of FIG. 1.

Specifically, the pattern surface of the silicon mastermold used inExample 1-1 is firstly coated with the resin composition of Preparation1 to a thickness of 15 μm and pre-cured for 3 minutes with a UV light of5 mJ/cm². The laminate was placed in a vessel, and a UV curable,acrylated butadiene resin composition was poured and cured to form abackbone layer to a thickness of 2 mm.

The cured product was removed from the vessel and an organic mold havingthe desired pattern with an acrylated butadiene backbone was lifted offfrom the mastermold, and then additionally irradiated with UV (5 mJ/cm²)for 2 hours to completely cure the organic mold.

FIG. 2 a is an electronic microscopic photograph of an organic moldfabricated as in Example 1-1 which has an equal line width and space of80 nm.

Further, FIG. 3 a is an electronic microscopic photograph of an organicmold having a cylindrical pattern, in which cylindrical cavities havinga 100 nm diameter and a 450 nm height were aligned in series, fabricatedas in Example 1-1.

EXAMPLE 2-1

The organic mold shown in FIG. 2 a was employed to form a pattern by asoft molding method. Specifically, a polystyrene resin solution wascoated on a silicon wafer substrate and, on the coated resin layer, themold was placed and slightly pressed to transfer the desired pattern onthe polystyrene resin layer. FIG. 2 b shows an electronic microscopicphotograph of the pattern thus formed.

EXAMPLE 2-2

The organic mold shown in FIG. 3 a was employed to form a pattern by UVflash replication method. Specifically, a UV-curable, acrylated epoxyresin solution was coated on a PET substrate, the prepared mold wasplaced on the coated epoxy resin layer, and then the resulting laminatewas irradiated with UV to cure the epoxy resin composition. FIG. 3 b isan electronic microscopic photograph of the pattern thus formed.

FIGS. 2 b and 3 b illustrate that the mold fabricated from the inventiveresin composition can provide submicropatterns without the problem ofadhesion or generating defects.

EXAMPLES 3 and 4

The procedure of Example 1-1 was repeated except for using the moldcomposition of Preparation 2 and 3 instead of the composition ofPreparation 1, respectively, to fabricate organic molds, which were thenused in forming patterns according to Example 2-1.

The organic molds thus fabricated and the patterns obtained therefromhave the same characteristics observed in FIGS. 2 a and 3 a, and 2 b and3 b, respectively.

COMPARATIVE EXAMPLE 1

The procedure of Example 1-1 was repeated except that the resincomposition of Preparation 4 which contains no functionalized additive,and a silicon mastermold having a pyramid pattern, in which pyramidshaped cavities having a bottom area of 180 μm×180 μm and a height of 70μm were aligned in series, was used to fabricate an organic mold.

FIG. 4 a is an optical microscopic photograph of the pyramidpatterns-forming mastermold, and FIG. 4 b is an optical microscopicphotograph of an organic mold fabricated using the mastermold. Bycomparing FIG. 4 a and FIG. 4 b, it can be seen that the organic moldthus fabricated has several defects.

COMPARATIVE EXAMPLE 2

The procedure of Example 1-1 was repeated except that the organic moldcomposition of Preparation 5 comprising a smaller amount of a reactivediluent was used to fabricate an organic mold. The organic mold brokeeasily during the patterning step due to its high brittleness.

While the invention has been described with respect to the abovespecific examples, it should be recognized that various modificationsand changes may be made to the invention by those skilled in the artwhich also fall within the scope of the invention as defined by theappended claims.

1. A resin composition for a mold used in forming micropatterns, whichcomprises: (A) 40 to 90 parts by weight of an active energy curableurethane-based oligomer having a reactive group selected from the groupconsisting of (meth)acrylate, vinylether, arylether, and a combinationthereof; (B) 10 to 60 parts by weight of a monomer reactive with theurethane-based oligomer, having a reactive group selected from the groupconsisting of (meth)acrylate, vinylether, arylether, and a combinationthereof; (C) 0.01 to 200 parts by weight of a silicone or fluorinecontaining compound, based on 100 parts of the sum of the components (A)and (B); and (D) 0.1 to 10 parts by weight of a photoinitiator, based on100 parts of the sum of the components (A), (B) and (C).
 2. Thecomposition according to claim 1, wherein the active energy curableurethane-based oligomer is selected from the group consisting of linearaliphatic, cycloaliphatic and aromatic urethane-based oligomers havingat least two reactive groups, and a mixture thereof.
 3. The compositionaccording to claim 1, which further comprises at least one reactiveoligomer selected from the group consisting of a (meth)acrylatedpolyester, (meth)acrylated polyether, (meth)acrylated epoxy,(meth)acrylated polycarbonate, (meth)acrylated polybutadiene, and amixture thereof, as a substituent of Component A.
 4. The compositionaccording to claim 1, wherein the (meth)acrylate used as Component B isselected from the group consisting of isobornyl acrylate, 1,6-hexanediolacrylate, triethyleneglycol di(meth)acrylate, trimethylol propanetriacrylate, tetraethyleneglycol di(meth)acrylate, 1,3-butanedioldiacrylate, 1,4-butanediol diacrylate, diethyleneglycol diacrylate,neopentylglycol diacrylate, neopentylglycol di(meth)acrylate,polyethyleneglycol di(meth)acrylate, pentaerythritol triacrylate,dipentaerythritol (hydroxy)pentaacrylate, alkoxylated tetraacrylate,octadecyl acrylate, isodecyl acrylate, lauryl acrylate, stearylacrylate, behenyl acrylate, styrenic monomer, and a mixture thereof. 5.The composition according to claim 1, wherein the vinyl ether used asComponent B is selected from the group consisting of cyclohexyl vinylether, 2-ethylhexyl vinyl ether, dodecyl vinyl ether, 1,4-butanedioldivinyl ether, 1,4-hexanediol divinyl ether, diethylene glycol divinylether, ethyleneglycol butyl vinyl ether, ethyleneglycol divinyl ether,triethyleneglycol methylvinyl ether, triethyleneglycol divinyl ether,trimethylol propane trivinyl ether, 1,4-cyclohexane dimethanol divinylether, and a mixture thereof.
 6. The composition according to claim 1,wherein the aryl ether used as Component B is selected from the groupconsisting of aryl propyl ether, aryl butyl ether, pentaerythritoltriary ether, and a mixture thereof.
 7. The composition according toclaim 1, wherein the silicone or fluorine-containing compound is atleast one selected from: (i) a silicone-containing reactive compoundselected from the group consisting of a silicone-containing vinylderivative, silicone-containing (meth)acrylate,(meth)acryloxy-containing organosiloxane, silicone polyacrylate, and amixture thereof; (ii) a fluorine-containing reactive compound selectedfrom the group consisting of a fluoroalkyl-containing vinyl derivative,fluoroalkyl-containing (meth)acrylate, fluorine polyacrylate, and amixture thereof; (iii) a silicone or fluorine containing resin, or amixture thereof; and (iv) a silicone or fluorine containing surfactantor oil, or a mixture thereof.
 8. The composition according to claim 1,wherein the photoinitiator is at least one of a free radical initiatorselected from the group consisting of benzyl ketals, benzoin ethers,acetophenone derivatives, ketoxime ethers, benzophenone, benzo andthioxantone compounds, and mixtures thereof, and a cationic initiatorselected from the group consisting of onium salts, ferrocenium salts,diazonium salts, and mixtures thereof.
 9. A method for fabricating anorganic mold, which comprises coating or casting the resin compositionrecited in claim 1 on a pattern face of a mastermold, placing a supporton the resin layer, irradiating the resulting laminate with an activeenergy ray to preliminarily cure the resin composition, lifting off theorganic mold having a reverse pattern face to that of the mastermold andintegrally formed with the support from the mastermold, and completelycuring the organic mold.
 10. The method according to claim 9, whichfurther comprises adhering a soft or rigid backing having a curved orflat face to the bottom face of the organic mold.
 11. A method forfabricating an organic mold, which comprises coating or casting a resincomposition recited in claim 1 on a pattern face of a mastermold,irradiating the resin layer with an active energy ray to preliminarilycure it, pouring a UV- or heat-curable resin composition onto the curedresin layer as a backbone, heating or irradiating the resultant tocompletely cure the resin and the backbone layers, lifting off theorganic mold having a reverse pattern face to that of the mastermold andintegrally formed with the backbone layer from the mastermold, andcompletely curing the organic mold.